Raw Material Procurement: The raw materials used in chip manufacturing, such as silicon wafers, chemicals, and gases, are sourced from various countries, including the United States, Japan, Taiwan, and South Korea.
Fabrication: The fabrication process involves several complex processes, including photolithography, etching, deposition, and doping, among others. These processes typically take place in facilities known as "fabs," which are located in countries such as the United States, Taiwan, South Korea, Japan, and China.
Testing: The testing of chips is a critical process to ensure that they meet the required specifications. Testing facilities are located in several countries, including the United States, Taiwan, South Korea, Japan, and China.
Packaging: The packaging of chips typically takes place in facilities located in countries such as Taiwan, China, and the United States.
Distribution: The final stage of the supply chain involves the distribution of chips to end-users, which can include original equipment manufacturers (OEMs), distributors, and retailers. Distribution centers are located in various countries worldwide, including the United States, China, Taiwan, South Korea, Japan, and Europe.
Overall, chip manufacturing is a highly globalized industry that relies on the efficient coordination of multiple countries and regions throughout the supply chain.